Zeki Candan
Professor
Istanbul University
Turkey
Biography
Zeki Candan is currently working at Istanbul University. He received his B.S., M.S., and Ph.D. degrees in Forest Products Engineering from Istanbul University.He has many publications including peer-reviewed international journal papers and presentations. Dr. Candan has received many national or international honors & awards including Second Class Honors – Forest Products Engineering, Istanbul University; Second Place in poster competition at the Forest Products Society 62nd International Convention, the United States in 2008; Travel Grant at the TAPPI International Conference on Nanotechnology for the Forest Products, the United States in 2008; Third Place in poster competition at the Society of Wood Science and Technology 52nd International Annual Convention, the United States in 2009; Wood Preservation Award at the Forest Products Society 67th International Convention, the United States in 2013; First Place in National R&D Project Competition, Republic of Turkey Ministry of Economy, Turkey in 2013; Third Place in National R&D Project Competition, Republic of Turkey Ministry of Economy, Turkey in 2013; Third Place in National R&D Project Competition, Republic of Turkey Ministry of Economy, Turkey in 2014; First Place in National R&D Project Competition, Republic of Turkey Ministry of Economy, Turkey in 2015. He has been as a Visiting Researcher at many universities in the United States, Europe, and China. Dr. Candan is active in several professional societies including the Forest Products Society; the Society of Wood Science and Technology (for whom he served as a member of the Membership Committee and the Visiting Scientist Committee); the Society for Adhesion and Adhesives. Dr. Candan has been as editor, editorial board member, and reviewer in many international peer-reviewed journals.
Research Interest
. His research involves nanotechnology applications in wood composites, biomaterials, and thermosetting & thermoplastic adhesives, nanocellulose-reinforced adhesives and composites, nanocomposites & bionanocomposites, thermal analysis methods (DMA, TMA, TGA, DTA, DSC).